Home / Products / High Voltage / HV Active Components / Solid-State Switches / B4 fixed on-time, low on-resistance, MOSFET
HV switches with fixed on-time, low on-resistance, MOSFET
HV switch in Trench-FET technology for extremely low on-resistance. Low control power also at higherswitching frequencies.
Products
Options
Products
| Switch Model | Max. Voltage (kV) | Peak Current (A) | On-Resist. (Ω) | On-Time (ns) | Housing Dimensions (mm3 ) | Datasheet |
| HTS 30-60-B | 3 | 600 | 0.19 | 150 | 89 x 64 x 31 | |
| HTS 40-06-B | 4.8 | 60 | 1.52 | 150 | 135 x 20 x 20 | |
| HTS 40-12-B | 4.8 | 120 | 0.76 | 150 | 79 x 38 x 25 | |
| HTS 40-26-B | 4.8 | 260 | 1.3 | 220 | 79 x 38 x 25 | |
| HTS 40-60-B | 4.8 | 600 | 0.3 | 150 | 122 x 64 x 31 | |
| HTS 60-24-B | 6 | 240 | 0.48 | 150 | 89 x 64 x 31 | |
| HTS 60-30-B | 6 | 300 | 0.38 | 150 | 89 x 64 x 31 | |
| HTS 60-60-B | 6 | 600 | 0.38 | 150 | 153 x 64 x 31 | |
| HTS 70-30-B | 7.2 | 300 | 0.46 | 150 | 89 x 64 x 31 | |
| HTS 90-96-B | 9 | 960 | 0.71 | 150 | 204 x 103 x 35 | |
| HTS 90-06-B | 9.6 | 60 | 3.4 | 150 | 79 x 38 x 25 | |
| HTS 90-13-B | 9.6 | 130 | 0.65 | 220 | 79 x 38 x 25 | |
| HTS 90-30-B | 9.6 | 300 | 0.6 | 150 | 122 x 64 x 31 | |
| HTS 100-12-B | 10.8 | 120 | 1.71 | 200 | 89 x 64 x 27 | |
| HTS 120-30-B | 12 | 300 | 0.76 | 150 | 153 x 64 x 31 | |
| HTS 120-96-B | 12 | 960 | 0.48 | 150 | 253 x 103 x 35 | |
| HTS 160-48-B | 16.8 | 480 | 0.67 | 150 | 174 x 103 x 35 | |
| HTS 180-48-B | 18 | 480 | 0.71 | 150 | 204 x 103 x 35 | |
| HTS 240-48-B | 24 | 480 | 0.95 | 150 | 253 x 103 x 35 | |
| HTS 240-104-B | 24 | 1040 | 0.4 | 250 | 253 x 103 x 35 |
Options
| Options | Description |
| B-CON | Beginner’s Configuration: The standard switch is equipped with various options to simplify first time experiments for users which are inexperienced with high voltage and high frequency circuit design. The beginner’s configuration includes option FH and PT-HV for easy wiring and attachment without printed circuit boards |
| HFB | High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated. |
| HFS | High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2) |
| LP | Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3) |
| DT | Delayed Trigger: “Total Turn-On Time” irreversibly increased to >1 μs. Required if national or international export restrictions apply (“dual use products”). (2) |
| S-ON | Soft Turn-On: Turn-On Rise Time increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
| S-OFF | Soft Turn-Off: Turn-Off Rise Time increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
| S-TT | Soft Transition Time: Turn-On Rise Time & Turn-Off Rise Time increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
| TT-C | Customized Transition Time: Customized rise & fall times to meet individual design requirements. (2) |
| TT-P | Programmable Transition Time: Switching speed adjustable in certain limits by means of external programming resistors. (2) |
| OT-1μ | On-Time Extension: On-Time increased to 1 μs. Turn-Off Rise Time >500 ns. |
| OT-10μ | On-Time Extension: On-Time increased to 10 μs. Turn-Off Rise Time > 5 μs. |
| OT-100μ | On-Time Extension: On-Time increased to 100 μs. Turn-Off Rise Time >50 μs. |
| OT-C | Customized On-Time: On-Time according to customer’s specifications. Any value between 100 ns and 100 μs. |
| OT-P | Programmable On-Time: On-Time adjustable in certain limits by means of external programming resistors. (2) |
| MIN-PS | Minimum Pulse Spacing: Individually increased Recovery Time to ensure a minimum HV pulse spacing indepently of control pulse spacing. For safety relevant circuits. |
| ST | Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo). |
| LNC | Low Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f). |
| LL | Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series. |
| ISO-25 | 25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models. |
| ISO-40 | 40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
| ISO-80 | 80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
| I-PC | Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors |
| I-FWD | Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only. |
| I-FWDN | Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only. |
| SEP-C | Separate Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails |
| FOI-C | Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2) |
| FOO-F | Fibre Optics Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2) |
| I-PC | Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors |
| LS-C | LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3) |
| PT-C | Pigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. Recommended for modules with options CF & GCF. |
| PIN-C | Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard. |
| PT-HV | Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits. |
| ST-HV | Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting. |
| UL94 | Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
| FH | Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested. |
| TH | Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. ‚ |
| FC | Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF |
| ITC | Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
| CF | Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants. |
| CF-1 | Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil). |
| CF-X2 | “Copper Cooling Fins “”XL””: Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.” |
| CF-X3 | “Copper Cooling Fins “”XXL””: Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.” |
| CF-CS | Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1 |
| CF-LC | Copper Cooling Fins for liquid cooling: Double fins |
| CF-D | Double Copper Cooling Fins: Approx. 100% more cooling power |
| CF-S | Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D |
| CF-GRA | Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer |
| CF-CER | Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm. |
| CCS | Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended. |
| CCF | Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation. |
| C-DR | Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2) |
| GCF | Grounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance Cc. |
| GCF-X2 | Grounded Cooling Flange |
| ILC | Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants including mains water. Internal heat exchanger made of ceramics. For medium power applications. |
| DLC | Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling solution especally for high frequency applications. For non-conductive coolants only. |
| HI-REL | High Reliability / MIL Versions: Available on request. (2) |
| [1] | New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table. |
| [2] | Please consult factory for detailed information. |
| [3] | These options are EMC-relevant and are recommended for industrial power applications |