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HV switch, variable on-time, bi-directional / AC voltage, MOSFET

Technical Note: The solid-state switches have extreme rise and fall times. If your application does not require the full switching speed we suggest you the use of the speed limiting option S-TT (rise & fall times slower by approx. 50%) in combination with the input low pass filter option LP. These options help to minimize the high frequency difficulties typical for fast high voltage pulse circuits (e.g. self oscillating or self re-triggering) and simplify the EMC design in general.

Features:

Versatile HV switch with true relay character
Polarity independent
Robust regarding overload and voltage reversal

Application Note

Products

Options

Products


Switch Model	Max. Voltage (kV)	Peak Current (A)	On-Resist. (Ω)	On-Time (ns)	Housing Dimensions (mm3 )	Datasheet
HTS 11-07-AC-C	1.2	70	2.4	70…∞	79 x 38 x 17
HTS 21-07-AC-C	2.4	70	4.8	100…∞	125 x 38 x 17
HTS 31-02-AC-LC-C	3.6	25	18	50…∞	79 x 38 x 17
HTS 31-03-AC-C	3	30	10	50…∞	79 x 38 x 17
HTS 31-06-AC-B-C	3.6	60	2.4	80…∞	79 x 38 x 17
HTS 31-13-AC-B-C	3.6	130	1	100…∞	79 x 38 x 17
HTS 41-02-AC-C	4.8	25	12	50…∞	79 x 38 x 17
HTS 61-01-AC-C	6	15	48	50…∞	79 x 38 x 17
HTS 61-03-AC-C	6	30	20	80…∞	125 x 38 x 17
HTS 61-03-AC	6	30	20	150…∞	121 x 64 x 28
HTS 61-06-AC	6	60	10	150…∞	121 x 64 x 28
HTS 71-02-AC-LC-C	7.2	25	36	80…∞	125 x 38 x 17
HTS 71-06-AC-B-C	7.2	60	4.8	110…∞	125 x 38 x 17
HTS 71-06-AC-B	7.2	63	4.8	200…∞	121 x 64 x 28
HTS 71-12-AC-B	7.2	125	2.4	200…∞	121 x 64 x 28
HTS 71-13-AC-B-C	7.2	130	2	130…∞	125 x 38 x 17
HTS 91-01-AC-C	9	12	84	70…∞	79 x 38 x 17
HTS 91-02-AC-C	9.6	25	24	80…∞	125 x 38 x 17
HTS 101-01-AC	10	15	96	150…∞	121 x 64 x 28
HTS 101-03-AC	10	30	48	150…∞	121 x 64 x 28
HTS 101-02-AC-LC-C	10.8	25	54	80…∞	125 x 38 x 17
HTS 101-06-AC-B	10.8	63	7.2	200…∞	172 x 70 x 28
HTS 101-12-AC-B	10.8	125	3.6	200…∞	172 x 70 x 28
HTS 121-01-AC-C	12	15	96	80…∞	125 x 38 x 17
HTS 121-01-AC	12	15	96	150…∞	121 x 64 x 28
HTS 121-03-AC	12	30	48	150…∞	121 x 64 x 28
HTS 121-10-AC	12	100	3.9	120…∞	103 x 70 x 35
HTS 121-20-AC	12	200	1.95	120…∞	103 x 70 x 35
HTS 151-10-AC	15	100	6.84	120…∞	175 x 75 x 56
HTS 151-20-AC	15	200	3.42	120…∞	175 x 75 x 56
HTS 161-01-AC	16	15	144	200…∞	172 x 70 x 28
HTS 161-03-AC	16	30	72	200…∞	172 x 70 x 28
HTS 181-01-AC-C	18	12	168	100…∞	125 x 38 x 17
HTS 181-01-AC	18	15	144	200…∞	172 x 70 x 28
HTS 181-03-AC	18	30	72	200…∞	172 x 70 x 28
HTS 211-06-AC-B	21.6	63	14.4	250…∞	263 x 70 x 35
HTS 211-12-AC-B	21.6	125	7.2	250…∞	263 x 70 x 35
HTS 331-01-AC	33	15	288	250…∞	263 x 70 x 35
HTS 331-03-AC	33	30	144	250…∞	263 x 70 x 35
HTS 361-01-AC	36	15	288	250…∞	263 x 70 x 35
HTS 361-03-AC	36	30	144	250…∞	263 x 70 x 35
HTS 201-10-AC	20	100	7.8	150…∞	200 x 75 x 56
HTS 201-20-AC	20	200	3.9	200…∞	200 x 75 x 56
HTS 241-40-AC	24	400	2.3	200…∞	252 x 150 x 56
HTS 301-10-AC	30	100	11.7	150…∞	275 x 75 x 56
HTS 301-20-AC	30	200	5.9	200…∞	275 x 75 x 56
HTS 401-10-AC	40	100	15.6	150…∞	350 x 75 x 56
HTS 401-20-AC	40	200	7.8	200…∞	350 x 75 x 56
HTS 501-10-AC	50	100	18	250…∞	252 x 150 x 68
HTS 501-20-AC	50	200	9	250…∞	252 x 200 x 68
HTS 501-40-AC	50	400	4.5	250…∞	372 x 150 x 68
HTS 701-10-AC	70	100	25	250…∞	312 x 150 x 68
HTS 701-20-AC	70	200	12.5	250…∞	312 x 200 x 68
HTS 901-10-AC	90	100	32	250…∞	372 x 150 x 68
HTS 901-20-AC	90	200	16	250…∞	372 x 200 x 68
HTS 1001-10-AC	100	100	36	250…∞	432 x 150 x 68
HTS 1001-20-AC	100	200	18	250…∞	432 x 200 x 68
HTS 1001-40-AC	100	400	9	250…∞	372 x 150 x 130
HTS 1201-10-AC	120	100	42	250…∞	492 x 150 x 68
HTS 1201-20-AC	120	200	21	250…∞	492 x 200 x 68
HTS 1401-10-AC	140	100	52	250…∞	672 x 150 x 68
HTS 1401-20-AC	140	200	26	250…∞	672 x 200 x 68

Options


Options	Description
B-CON	Beginner’s Configuration: The standard switch is equipped with various options to simplify first time experiments for users which are inexperienced with high voltage and high frequency circuit design. The beginner’s configuration includes option FH and PT-HV for easy wiring and attachment without printed circuit boards

HFB	High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.
HFS	High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2)
LP	Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3)
S-TT	Soft Transition Time: ”Turn-On Rise Time” & “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
MIN-ON	Minimum On-Time: Individually increased Minimum On-Time to ensure a minimum on duration indepently of control signal. For safety relevant circuits.
MIN-OFF	Minimum Off-Time: Individually increased Minimum Off-Time to ensure a minimum off duration indepently of control signal. For safety relevant circuits.
ST	Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).
LNC	Low Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f).
LL	Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series.
LN	Low Noise: Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP applications) only. (2)
ISO-25	25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models.
ISO-40	40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
ISO-80	80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
ISO-120	120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
PL	Passive Lock: Special inhibit function for two single switches in fast push-pull circuits. The input of the passive switch will be locked by the activated switch to avoid turn-on by noise.
I-PC	Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
I-FWD	Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only.
I-FWDN	Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only.
LS-C	LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. For improved noise immunity. (3)
PT-C	Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-modu plug. Refers to switching modules with pins only. Suggested for modules with options CF & GCF.
PT-HV	Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not for extremely fast circuits.
ST-HV	Screw Terminals for HV Connection: Threaded inserts at the bottom of module for PCB attachment. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.
SEP-C	Separated Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.
FOI-I	Fibre Optics Input / Inhibit: Additional optical inhibit input to turn-off the switch by using the inhibit input with a fibre-optical signal (only in combination with option SEP-C) (2)
FOI-C	Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)
FOO-F	Fibre Optical Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2)
UL94	Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
FH	Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.
TH	Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2)
FC	Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF
ITC	Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)
CF	Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.
CF-1	Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).
CF-X2	“Copper Cooling Fins “”XL””: Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.”
CF-X3	“Copper Cooling Fins “”XXL””: Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.”
CF-CS	Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1
CF-LC	Copper Cooling Fins for liquid cooling: Double fins
CF-D	Double Copper Cooling Fins: Approx. 100% more cooling power
CF-S	Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D
CF-GRA	Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer
CF-CER	Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.
CCS	Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.
CCF	Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DR	Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
GCF	Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC.
GCF-X2	Grounded Cooling Flange
ILC	Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.
DLC	Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.
HI-REL	High Reliability / MIL Versions: Available on request. (2)

[1]	New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.
[2]	Please consult factory for detailed information.
[3]	These options are EMC-relevant and are recommended for industrial power applications

HV switch, variable on-time, bi-directional / AC voltage, MOSFET

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