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HV switches variable on-time, general purpose, MOSFET
Versatile and cost-efficient HV switch with true relay character. Negligible dynamic switching losses due to fast transistion time. Excellent dv/dt immunity against HV transients
Features:
- On-time controllable by TTL signal
- Robust regarding overload and voltage reversal
- Very compact and lightweight design
Products
Options
Products
Compact series. Preferred in applications with requirements on small build volume and low stray inductance.
| Switch Model | Max. Voltage (kV) | Peak Current (A) | On-Resist. (Ω) | On-Time (ns) | Housing Dimensions (mm3 ) | Datasheet |
| HTS 11-14-C | 1.2 | 140 | 1.2 | 50…∞ | 79 x 38 x 17 | |
| HTS 21-07-C | 2.4 | 70 | 2.4 | 50…∞ | 79 x 38 x 17 | |
| HTS 31-06-C | 3 | 60 | 5 | 50…∞ | 79 x 38 x 17 |  |
| HTS 31-05-C | 3.6 | 50 | 7 | 50…∞ | 79 x 38 x 17 | |
| HTS 41-05-C | 4.8 | 50 | 6 | 50…∞ | 79 x 38 x 17 | |
| HTS 61-03-C | 6 | 30 | 10 | 50…∞ | 79 x 38 x 17 | |
| HTS 61-06-C | 6 | 64 | 5.2 | 75…∞ | 175 x 50 x 30 | |
| HTS 71-02-LC-C | 7.2 | 25 | 14 | 50…∞ | 79 x 38 x 17 | |
| HTS 91-02-C | 9.6 | 25 | 12 | 50…∞ | 79 x 38 x 17 | |
| HTS 91-05-C | 9.6 | 50 | 6 | 80…∞ | 125 x 38 x 17 | |
| HTS 101-02-LC-C | 10.8 | 25 | 21 | 80…∞ | 125 x 38 x 17 | |
| HTS 121-01-C | 12 | 15 | 48 | 50…∞ | 79 x 38 x 17 | |
| HTS 121-03-C | 12 | 32 | 21 | 75…∞ | 175 x 50 x 30 | |
| HTS 181-01-C | 18 | 12 | 60 | 50…∞ | 79 x 38 x 17 | |
| HTS 181-02-C | 18 | 24 | 36 | 75…∞ | 175 x 50 x 30 | |
| HTS 241-01-C | 24 | 15 | 120 | 75…∞ | 175 x 50 x 30 | |
| HTS 361-01-C | 36 | 12 | 120 | 75…∞ | 175 x 50 x 30 | |
Standard series. Preferred in applications with higher requirements on cooling power and isolation voltage.
| Switch Model | Max. Voltage (kV) | Peak Current (A) | On-Resist. (Ω) | On-Time (ns) | Housing Dimensions (mm3 ) | Datasheet |
| HTS 051-64 | 0.5 | 640 | 0.043 | 100…∞ | 89 x 64 x 27 | |
| HTS 11-30 | 1 | 320 | 0.17 | 100…∞ | 89 x 64 x 27 | |
| HTS 21-14 | 2 | 140 | 1 | 100…∞ | 89 x 64 x 27 | |
| HTS 21-50 | 2 | 500 | 0.3 | 200… ∞ | 178 x 64 x 27 | |
| HTS 31-06 | 3 | 60 | 3 | 100…∞ | 89 x 64 x 27 | |
| HTS 41-03 | 4 | 30 | 8 | 100…∞ | 89 x 64 x 22.5 | |
| HTS 51-06 | 5 | 60 | 5 | 100…∞ | 89 x 64 x 27 | |
| HTS 51-20 | 5 | 200 | 1.2 | 200… ∞ | 178 x 64 x 27 | |
| HTS 61-03 | 6 | 30 | 12 | 100…∞ | 89 x 64 x 22.5 | |
| HTS 61-02 | 6 | 25 | 12 | 50…∞ | 89 x 64 x 22.5 | |
| HTS 61-05 | 6 | 50 | 6 | 100…∞ | 89 x 64 x 22.5 | |
| HTS 71-06 | 7 | 60 | 6 | 120… ∞ | 135 x 64 x 27 | |
| HTS 71-12 | 7 | 120 | 3 | 150… ∞ | 135 x 64 x 27 | |
| HTS 81-09 | 8 | 90 | 5 | 200… ∞ | 178 x 64 x 27 | |
| HTS 91-06 | 9 | 60 | 8 | 150… ∞ | 172 x 70 x 28 | |
| HTS 91-12 | 9 | 120 | 4 | 150… ∞ | 172 x 70 x 28 | |
| HTS 101-01 | 10 | 15 | 36 | 50…∞ | 89 x 64 x 22.5 | |
| HTS 101-03 | 10 | 30 | 18 | 100…∞ | 89 x 64 x 22.5 | |
| HTS 111-12 | 11 | 120 | 4.7 | 150… ∞ | 200 x 70 x 28 | |
| HTS 141-03 | 14 | 30 | 28 | 150… ∞ | 135 x 64 x 27 | |
| HTS 141-06 | 14 | 60 | 14 | 150… ∞ | 135 x 64 x 27 | |
| HTS 151-01 | 15 | 12 | 50 | 50…∞ | 89 x 64 x 22.5 | |
| HTS 151-02 | 15 | 24 | 25 | 100…∞ | 89 x 64 x 22.5 | |
| HTS 161-03 | 16 | 30 | 34 | 150… ∞ | 172 x 70 x 28 | |
| HTS 161-06 | 16 | 60 | 17 | 150… ∞ | 172 x 70 x 28 | |
| HTS 181-06 | 18 | 60 | 17 | 150… ∞ | 172 x 70 x 28 | |
| HTS 181-12 | 18 | 120 | 8 | 150… ∞ | 263 x 70 x 35 | |
| HTS 221-03 | 22 | 30 | 44 | 150… ∞ | 200 x 70 x 28 | |
| HTS 221-06 | 22 | 60 | 22 | 150… ∞ | 200 x 70 x 28 | |
| HTS 241-06 | 24 | 60 | 22 | 150… ∞ | 200 x 70 x 28 | |
| HTS 331-03 | 33 | 30 | 55 | 150… ∞ | 263 x 70 x 35 | |
| HTS 331-06 | 33 | 60 | 27 | 150… ∞ | 263 x 70 x 35 | |
| HTS 361-06 | 36 | 60 | 27 | 150… ∞ | 263 x 70 x 35 |
Options
| Options | Description |
| B-CON | Beginners Configuration: The standard switch is equipped with various options to simplify first time experiments for users |
| MBC | “Mechanical Backward Compatibility to the previous switch models. All connectors |
| HFB | High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if > 10 pulses with < 10 μs spacing are generated. |
| HFS | High Frequency Switching: Ext. supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Max. Operating Frequency” shall be exceeded. (2) |
| LP | Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring. (3) |
| UFTR | Ultra Fast Thermotrigger: Advanced temperature protection for the high-voltage switch. Switch shut down within 5 seconds if Pd(max) is exceeded by 300% @ ΔT=25K (50to75°C) |
| UFTS | Ultra Fast Thermosensor:Temperature measurement directly on the power semiconductors by means of a special sensor with high electrical isolation and low thermal impedance. |
| S-ON | Soft Turn-On: “Turn-On Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
| S-OFF | Soft Turn-Off: “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
| S-TT | Soft Transition Time: ”Turn-On Rise Time” & “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
| TT-C | Customized Transition Time: Customized rise & fall times to meet individual design requirements. (2) |
| MIN-ON | Minimum On-Time: Individually increased Minimum On-Time to ensure a minimum on duration indepently of control signal. For safety relevant circuits. |
| MIN-OFF | Minimum Off-Time: Individually increased Minimum Off-Time to ensure a minimum off duration indepently of control signal. For safety relevant circuits. |
| ST | Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages. |
| LNC | Low Natural Capacitance: CN reduced by approx. 30%. To minimize cap. power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f). |
| LL | Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series. |
| LN | Low Noise: Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP) only. (2) |
| ISO-25 | 25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models. |
| ISO-40 | 40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
| ISO-80 | 80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
| ISO-120 | 120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
| I-PC | Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. capacitors |
| PC | Pulser Configuration. Switch combined with custom specific part components. Integrated in a flange housing with hv connectors according to the customers specifications. (2) |
| I-FWD | Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only. |
| I-FWDN | Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only. |
| I-TS | Integrated Thermo Sensor: Integrated temperature sensor for external temperature measurements according to customers specifications (NTC |
| LS-C | LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. For improved noise immunity. (3) |
| PT-C | Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-modu plug. Refers to switching modules with pins only. Suggested for modules with options CF & GCF. |
| PT-HV | Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not for extremely fast circuits. |
| ST-HV | Screw Terminals for HV Connection: Threaded inserts at the bottom of module for PCB attachment. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting. |
| SEP-C | Separated Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails. |
| FOI-I | Fibre Optics Input / Inhibit: Additional optical inhibit input to turn-off the switch by using the inhibit input with a fibre-optical signal (only in combination with option SEP-C) (2) |
| FOI-C | Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2) |
| FOO-F | Fibre Optical Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2) |
| UL94 | Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
| FH | Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested. |
| TH | Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2) |
| FC | Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF |
| ITC | Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
| CF | Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants. |
| CF-1 | Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil). |
| CF-X2 | “Copper Cooling Fins “”XL””: Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.” |
| CF-X3 | “Copper Cooling Fins “”XXL””: Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.” |
| CF-CS | Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1 |
| CF-LC | Copper Cooling Fins for liquid cooling: Double fins |
| CF-D | Double Copper Cooling Fins: Approx. 100% more cooling power |
| CF-S | Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D |
| CF-GRA | Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer |
| CF-CER | Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm. |
| CCS | Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended. |
| CCF | Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation. |
| C-DR | Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2) |
| GCF | Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC. |
| ILC | Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation. |
| DLC | Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only. |
| HI-REL | High Reliability / MIL Versions: Available on request. (2) |
| [1] | New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table. |
| [2] | Please consult factory for detailed information. |
| [3] | These options are EMC-relevant and are recommended for industrial power applications |